Micro Switch Manufacturer

• Complete the soldering at the iron tip temperature below 350°C within 5 seconds, and do not apply any external force for 1 minute after soldering. Soldering at an excessively high temperature or soldering for more than 5 seconds may deteriorate the characteristics of the Switch.

• Be sure to apply only the minimum required amount of flux. Switch may have contact failures if flux intrudes into the interior of the Switch.

• If the PCB terminal models are soldered in the solder bath, flux will permeate inside the Switch and cause contact failure. Therefore, manually solder the PCB terminal.

• Use M2.3 mounting screw with plane washers or spring washers to securely mount the Switch. Tighten the screws to a torque of 0.23 to 0.26 N·m {2.3 to 2.7 kgf·cm}.

• Mount the Switch onto a flat surface. Mounting on an uneven surface may cause deformation of the Switch, resulting in faulty operation or breakage in the housing.

Using a model for ordinary loads to open or close the contact of a micro load circuit may result in faulty contact. Use models that operate in the following range.

However, even when using micro load models within the following operating range, if inrush current occurs when the contact is opened or closed, it may increase the contact wear and so decrease durability. Therefore, insert a contact protection circuit where necessary.

The N-level reference value applies for the minimum applicable load. This value indicates the malfunction reference level for the reliability level of 60% (λ60).
(JIS C5003)
The equation, λ60=0.5×10-6/operation indicates that the estimated malfunction rate is less than operations with a reliability level of 60%.